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Semiconductor Engineering1 h

System-Level Design For 1.6 Tbps Interoperability In AI Data Centers

This article examines the system-level challenges in enabling seamless 1.6 Tbps port-level interoperability for next-generation SoCs. It focuses on the role of 224G SerDes, emerging interconnect ...
Semiconductor Engineering1 h

Maximize Uptime And Improve TCO: RAS And Telemetry In HBM4 For Data Centers

A single memory failure in a hyperscale AI cluster can cascade into hours of lost compute time.
Semiconductor Engineering1 h

UEC-CBFC: Credit-Based Flow Control For Next-Gen Ethernet In AI And HPC

CBFC uses two cyclic counters to track the credits consumed and freed at sender and receiver, respectively.
Semiconductor Engineering1 h

Moving Past “It Works” — Intelligent Optimization Is the Key to PCB Excellence

Adaptive optimization algorithms promise better results and deeper insight into why certain designs perform better than ...
Semiconductor Engineering1 h

Start Experimenting With Neural Super Sampling For Mobile Graphics

Neural Super Sampling (NSS) directly addresses these challenges. NSS is a next-generation AI-powered upscaling solution. It ...
Semiconductor Engineering2 h

Reliable Training Data Paramount To AI Model Success

Confidentiality, to a lesser extent, and integrity, to the greatest extent, are the most important considerations with AI ...
Semiconductor Engineering2 h

Will New Processor Architectures Raise Energy Efficiency?

Data centers continue to heat up as new processors consume more energy than ever before. Cooling is the primary weapon ...