The point that Europe has no appetite for manufacturing chips is underlined decisively by the sales of semiconductor manufacturing equipment in 2024, as compiled by the industry body SEMI. European ...

Flow Computing in Finland has started alpha testing of a RISC-V compiler for its Parallel Processing Unit (PPU) AI block. The PPU is capable of increasing any CPU architecture by up to 100X by using ...

Neo said it has developed both one transistor, one capacitor (1T1C) and three transistor, zero capacitor (3T0C) X-DRAM cells that are stackable. The company said that TCAD simulation has predicted the ...

POLYN Technology has completed the tape-out of its first product chip, which features an analogue neuromorphic core based on a Voice Activity Detection neural network model. The chip will be used to ...

French research institute CEA-Leti (Grenoble, France) has reported on its ability to integrate GaN microLED display, general light sources and organic photodetectors for multifunction displays. This ...

Specialty foundry Tower Semiconductor Ltd. (Migdal Haemek, Israel) withdrew from a plan to build a wafer fab in India “five or six months ago” according to CEO Russell Ellwanger. Speaking during an ...

KDDI Corporation, headquartered in Tokyo, has formed a strategic partnership with DriveNets Ltd., based in Israel, which focuses on promoting open network architecture. The open network architecture ...

In a major move for the automotive industry, Harman is to make its full connected services platform open source for scalable software defined vehicle (SDV) designs. The open source services are ...

Filtronic in the UK has signed a deal to develop and supply filter and diplexer assemblies to the next generation of OneWeb satellites. The satellites will be built by Airbus Defence and Space in ...

Compound semiconductor wafer supplier IQE plc (Cardiff, Wales) has appointed Jutta Meier as permanent CEO and presented loss-making full-year financial results for 2024. Meier has served as interim ...

Space Forge in Wales has raised £22.6m ($30m) for its second generation materials factory ahead of the launch of its first. The Series A round is the largest in UK space tech history and was led by ...

Researchers in China have developed a groundbreaking method to build high-aspect-ratio 3D microstructures with sub-10 micron resolution for RF sensors. The technique achieves deep trenches with a 1:4 ...